Innovative Integration
Innovative Integration provides board-level hardware products that integrate the best analog I/O and reconfigurable FPGAs to provide cost-effective solutions for challenging data acquisition and signal processing applications.
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TI unveils fastest, highest-performance analog front end for femtocells and portable…
Texas Instruments Incorporated (TI) (NASDAQ: TXN) introduced today the industry's fastest, highest-performance analog front end (AFE) for femtocell base stations and portable software-defined radio (SDR) applications.
The low-power, 12-bit AFE7225 integrates a dual 125-MSPS analog-to-digital converter (ADC) and dual 250-MSPS digital-to-analog converter (DAC). It operates 25-percent faster than the competition, while increasing the...
preview:
http://newscenter.ti.com
date: 1/20/2012
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new product
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Introducing TI's SimpleLink product family: The industry's broadest portfolio of …
Building from more than a decade of proven leadership in the wireless connectivity space, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today unveiled the SimpleLink™ product family, the industry's widest portfolio of easy-to-use wireless connectivity technologies for low-power, low-cost embedded applications.
The SimpleLink family includes self-contained wireless processors, aimed at enabling easy integration with any embedded system. ...
preview:
http://newscenter.ti.com
date: 1/20/2012
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new product
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Zigbee Alliance Begins Developing Zigbee 3d Sync Standard
The ZigBee® Alliance, a global ecosystem of organizations creating wireless solutions for use in energy management, residential, commercial and consumer applications, today announced it is developing a new standard to deliver the ultimate 3D viewing experience, ZigBee 3D Sync.
The standard will create more flexible and efficient 3D connections between 3D HDTVs and 3D glasses.
ZigBee 3D Sync will replace 30 year-old infrared (IR) technology...
preview:
https://docs.zigbee.org
date: 1/19/2012
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new product
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AppliedMicro Enables Multi-gigabit Data Rates for Next Generation IEEE 802.11ac…
Applied Micro Circuits Corporation (NASDAQ:AMCC), or AppliedMicro today announced that its Catalina APM86491 embedded System-on-a-Chip (SoC) processor represents the industry’s first solution tailored specifically for next generation IEEE 802.11ac wireless access points.
Catalina’s enterprise-class QoS engine, TCP offload engines, a 4Gbps packet classification engine and application aware offloads allow consumers to store, stream and share...
preview:
http://investor.appliedmicro.com
date: 1/19/2012
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new product
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Major operators scale up small cell deployments and set sights on rural, enterprise and LTE
Informa Telecoms & Media today issued its latest femtocell market status report which highlights that operators’ 3G small cell deployments are achieving volume and extending into new markets beyond the home.
It also registers the growing number of operators committing to LTE small cell deployments which are expected to form a key market trend in 2012.
There are currently 37 commercial deployments with regional US operator, Mosaic Telecom,...
preview:
http://femtoforum.org
date: 1/19/2012
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new product
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VIA Announces Android Support for Embedded x86 Boards
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced Android support for VIA x86 embedded platforms, starting with support for the VIA EITX-3002 Em-ITX board.
Running Android on an x86 platform offers increased flexibility, great multimedia support and cost saving advantages for embedded applications such as in-vehicle entertainment and interactive kiosks.
Key advantages for Android on x86...
preview:
http://www.via.com.tw
date: 1/19/2012
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