| | | Ironwood Electronics, Inc: eg3.com electronic tearsheet
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new product
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Chip Size 0.8mm Pitch BGA Socket Adapter for LG's XD™ Engine
Ironwood Electronics' new high performance socket - SF-BGA656A-B-64F allows 0.8mm pitch, 23x23mm body, 28X28 array LG's XD™ Engine to be socketed and operate without compromising performance in demanding HDTV applications. XD engine is a technology used in LG HDTV to enhance picture quality. In addition to providing de-interlacing and up-scaling, XD™ Engine also provides increased black levels and brightness of various aspects of the picture...
http://www.ironwoodelectronics.com/press/chip_size_LG_XD.cfm
Classified with the keyword(s):
- industrial computing : news
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new product
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10 GHz Bandwidth Socket for 10 Lead ODFN Package
Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.5mm pitch 10 pin Optical DFN package. The SG-MLF-7059 socket is designed for an 3.5mmx2.1mmx0.65mm package size and operates at bandwidths up to 10 GHz with less than 1dB of insertion loss. The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 10 GHz bandwidth on all connections. The socket is mounted using...
http://www.ironwoodelectronics.com/press/10_ghz_socket_odfn_pckg.cfm
Classified with the keyword(s):
- industrial computing : news
- io-protocols : news
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new product
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40 GHz Bandwidth Socket for JEDEC's LFBGA361
Ironwood Electronics has recently introduced a new high performance BGA socket product line using unique elastomer capable of high speed, low inductance, high endurance and wide temperature applications. The SM-BGA-9006 socket is designed for 16X16 mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The socket is also designed to dissipate few watts with compression screw and can be customized up to...
http://www.ironwoodelectronics.com/press/40_GHz_bandwidthD_jedec.cfm
Classified with the keyword(s):
- industrial computing : news
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new product
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40 GHz Bandwidth Socket for 0.4mm Pitch QFN Packages
Ironwood Electronics has recently introduced a new high performance QFN socket for 0.4mm pitch QFN 56 pin IC's. The DG-QFN56B-01 socket is designed for a 7X7mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The socket is designed to dissipate 12 watts with lid mounted heat sink and fan. The contact resistance is typically 3 milliohms per pin. The socket connects all pins and the center ground pad...
http://www.ironwoodelectronics.com/press/40_GHz_bandwidth_qfn_package.cfm
Classified with the keyword(s):
- industrial computing : news
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new product
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Thermal Management Solution for IC devices
Ironwood Electronics' new high performance thermal socket lid - TSL-ST-01 allows any IC devices to be placed inside any socket and operated at IC's extreme temperature to determine its thermal capability. Thermal Socket Lid & Control Systems enable temperature control of IC devices during thermal characterization using direct thermal contact technology that provides accurate and stable temperatures on IC resulting in precise characterization....
http://www.ironwoodelectronics.com/press/thermal_management_solution.cfm
Classified with the keyword(s):
- industrial computing : news
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new product
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8 GHz Bandwidth Socket for Kyocera's 1760FCBGA
Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch, 1760 pin BGA IC's. The SG-BGA-6348 socket is designed for 42.5X42.5 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate 35 watts with active heat sinking (forced convection using a DC fan). The contact resistance is typically 20 milliohms per pin. The socket connects all...
http://www.ironwoodelectronics.com/press/8_ghz_socket_kyocera.cfm
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company
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Ironwood Electronics, Inc
High performance IC sockets and adapters for prototype, test, IC probing, debugging, and production applications. Offering adaptors to convert IC package to another, SMT package emulation, high speed logic probing and analyzer connectors. Packages include BGA, MLF (QFN), CSP, QFP, SOIC, TSOP, PLCC, PGA, DIP, etc. Innovations include GHz BGA and MLF sockets that support pitch densities to 0.3 mm and up to 40 GHz bandwidth. RoHS compliant products.
http://www.ironwoodelectronics.com/
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new product
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GHz Bandwidth Socket for Samsung's eMMC
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.5mm pitch, 14x18mm eMMC. eMMC describes an architecture consisting of an embedded storage solution with MMC (Multi Media Card) interface, flash memory and controller, all in a small ball grid array package. The SG-BGA-7219 socket is designed for testing eMMC BGA device and operates at bandwidths up to 10 GHz with less than 1dB of insertion loss. The contact...
http://www.ironwoodelectronics.com/press/samsung_emmc_socket.cfm
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