Coming Soon - Thermal Management in Today’s and Future Systems Architectures
Thermal management is becoming the critical issue in successful deployment of military systems.
Components are increasing in speed at an ever faster pace.
Compliance to thermal requirements is challenging and requires special design considerations.
Therefore, packaging designers need to rethink thermal considerations and provide innovative methods for thermal compliance.
preview:
http://www.aplabs.com/technical_papers.html
07/31/2007
