Structure for Packaging, Integrating and Re-using IP within Tool-flows One of the key challenges facing the semiconductor industry is to combine IP from various sources quickly and efficiently.
This industry level cooperation is developing standards for IP description as well as tools that raise automation levels and cut costs while improving ease-of-use and increasing flexibility in IP selection and integration.
preview:
http://www.spiritconsortium.com/
6/10/2003
