The growth of IEEE 802.11™ wireless local area networks and Bluetooth® wireless personal area networks in the 2.4-GHz band has resulted in the need to colocate the circuitry of each technology on a single silicon die. This paper describes the interference mitigation considerations undertaken by Broadcom to make such integration possible.
preview:
http://www.broadcom.com/collateral/wp/4325-WP100-R.pdf
01/2005/2009
