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Mindspeed Debuts Optical Physical Media Device (PMD) Chipsets for 3G/4G
Mindspeed Technologies, Inc., a leading supplier of semiconductor solutions for network infrastructure applications, today announced a high-performance, low-power physical media device (PMD) chipset that includes all necessary components required for CPRI-based optical transceivers that economically connect 3G/4G wireless base station servers to one or more remote radio heads (RRHs) over optical fiber.
preview: http://investors.mindspeed.com   date: 3/8/2010

new product    

Beceem and Motorola Accelerate Availability of 4G Chip Solution
Beceem Communications, the leading provider of 4G chips, and Motorola (NYSE: MOT) announced today that both companies are working together to pair Motorola’s advanced 4G WiMAX infrastructure with Beceem’s upcoming BCS500 4G chip. The BCS500 4G chip supports WiMAX 16e and 16m as well as UE Class 4 LTE capabilities in both the TDD and FDD configurations, including plans for handoff between WiMAX and LTE. The optimization of TDD and FDD...
preview: http://www.beceem.com   date: 2/22/2010

new product    

Infineon Introduces World's Smallest HSPA+ Solution for 3G Smart Phones
nfineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today at the Mobile World Congress 2010 announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards. This advanced HSPA+ platform is based on two new highly integrated Infineon devices: the...
preview: http://www.infineon.com   date: 2/22/2010