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Ensuring system integrity with SFFs
Safety Integrity Levels (SILs) are defined by the International Electrotechnical Commission (IEC) and other organizations to specify the number of allowable failures in electrical or electronic safety devices. Four SIL levels are possible, with SIL 4 being the most dependable and SIL 1 being the least. The SIL level depends on the average Probability of Failure on Demand (PFD), as shown in Table 1.
preview: http://www.smallformfactors.com   date: 03/22/2010 |

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Qseven mobilizes for power-optimized portability
Ultra-mobile applications such as patient monitors and rugged handheld computers require flexible options for extended battery operation. The up-and-coming Qseven form factor provides the low power consumption and smart battery configuration needed for these applications, as Christian explains in this overview of the specification.
preview: http://www.smallformfactors.com   date: 03/22/2010 |

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SBCs: Convergence or diversity
Amid all the excited discussion of network-centric warfare, autonomous unmanned vehicles, vision fusion systems, embedded training, and Software-Defined Radio, it’s easy to lose sight of the fact that, at the heart of all these state-of-the-art systems, designers and users will find the humble and often-overlooked SBC. And it’s easy to believe that, increasingly, all SBCs are pretty much the same in light of the trend toward more i...
preview: http://www.vmecritical.com   date: 04/15/2009 |

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Separating interconnects from form factors
Industry standards for board-level computer technology typically describe both a mechanical board form factor and a board-to-board communications interface. Yet as bus technologies multiply, it has become clear that multiple CPU form factors can offer the same expansion interface.
preview: http://www.smallformfactors.com   date: 03/27/2009 |

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Small, embedded SBCs support SUMIT interface
Pico-ITXe is a new, open standard SBC specification from the Small Form Factor Special Interest Group (SFF-SIG). It aligns well with the latest ultra-low-power chipsets from the VIA Nano and Intel Atom microprocessor families. Its dimensions are 100 mm x 72 mm, roughly the size of a 2.5'' notebook hard disk drive. The Pico-ITXe specification includes unique fixed mounting holes and Pico-I/O expansion connectors that allow stackable, I/O-centric...
preview: http://www.smallformfactors.com   date: 03/27/2009 |

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White Paper: Conduction Cooling Techniques for Rugged Computers
Conduction cooling for modular embedded computers has been used for many years in applications where air cooling is not appropriate. Standardization efforts have helped to maintain interoperability of COTS products. Conduction cooled design techniques are continuously improving to meet the requirements for higher power dissipation and lower price. This paper will examine why applications use conduction cooled boards, the concept of the Rugge...
preview: http://www.mil-embedded.com   date: 03/15/2010 |