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System in Package: Better performance, smaller footprint
Multichip packages can provide important advantages in circuit board layout.
System in Package (SiP) in particular can provide an effective solution for board design challenges related to size, weight, and performance requirements.
preview:
http://www.embedded-computing.com
date: 2/19/2009
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Designer's guide for Printed Circuit Board tolerances
PCBs are made from materials that will stretch, shrink, twist and bow. The most common material in general use is FR4. During the manufacturing process the laminates will be exposed to temperatures that will exceed their glass transition point (Tg) as well as many chemical processes.
With this in mind this note provides some general guidance on tolerances for PCBs.
Board Thickness The standard thickness of a PCB is normally around 1.6mm...
preview:
http://www.polarinstruments.com
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Reverse engineering for board test
Historically, customers are faced with situations where CCA data is not available for a variety of reasons.
Situations where Original Equipment Manufacturers (OEMs) have been acquired by other OEMs or designs have been generated prior to the age of remote storage or escrow agents can result in the loss of data.
Some companies, especially market segments such as depot repair, no longer have access to actual CAD or memory disks containing the...
preview:
http://www.mil-embedded.com
date: 10/22/2009
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