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CompactPCI moves ahead
Dog days? More like dogged pursuit of a number of markets for CompactPCI, and success as CompactPCI demonstrates its ability to adapt – check out the mil-areo app described in the Global Technology column this month.
preview:
http://www.compactpci-systems.com
date: 7/31/2009

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CompactPCI: Tough ally for transportation apps
Extreme conditions, round-the-clock performance, and high-speed processing have CompactPCI at the forefront of high-tech apps for tunnel surveillance, alert management, and traffic control.
preview:
http://www.compactpci-systems.com
date: 1/20/2010

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Extending the power of CompactPCI systems
Charlie walks us through a set of options designers now have as two new PICMG draft specifications affecting high-speed I/O in CompactPCI-based systems near completion.
This article focuses on the Ultra Hard Metric (UHM) socket connector from 3M. For more on this connector and the new draft specifications, see Pairing CompactPCI compatibility with high-speed serial data transfer, also in this issue.
preview:
http://www.compactpci-systems.com
date: 7/31/2009

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In-flight entertainment: Designers get on board with COMs and CompactPCI
David and Christine point out that engineers working with 3U CompactPCI and targeting applications such as In-flight personal video screens, video games, destination maps, Internet access, and interactive seat-to-seat messaging, must deal with the challenges of restricted space, thermal requirements, shock and vibration, and altitude considerations – and handle all these a cost-effective, high availability solution.
preview:
http://www.compactpci-systems.com
date: 3/12/2009

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Pairing CompactPCI compatibility with high-speed serial data transfer
A pair of draft specifications aims to rescue developers from having to opt for investment protection or performance, but not both.
Note that the 3M Ultra Hard Metric (UHM) connector described here is also referenced in a related article in this issue, Extending the power of CompactPCI systems
preview:
http://www.compactpci-systems.com
date: 7/31/2009

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CompactPCI solution targets rugged apps
Jeff walks us through the features of a processor board design that was the result of efforts to stay within a desired thermal envelope yet boost performance.
One of the challenges in the architecture and design of CompactPCI processor board is staying within a reasonable thermal envelope.
In general, reasonable is something under 50 W. Developers know, of course, what is available in their local computer stores, and have an expectation...
preview:
http://www.mil-embedded.com
date: 10/27/2009
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